Tungsten Round Sputtering Target for Vacuum Coating
This high-purity tungsten sputtering target is designed for vacuum coating applications. It maintains hardness and ductility, making it suitable for semiconductor and micro-electronic applications.
Technical Specifications
Product Overview
High-Purity Tungsten Sputtering Targets
These tungsten sputtering targets are engineered for high-performance vacuum coating and PVD processes, offering exceptional stability in high-temperature environments. Characterized by the highest melting point of all pure metals and the lowest coefficient of thermal expansion, they ensure the deposition of homogeneous thin films. These targets are specifically optimized for semiconductor, micro-electronics, and TFT-LCD screen manufacturing where chemical purity and density are critical for electrical conductivity.
Material Properties
- Melting Point
- 3422 °C
- Thermal Expansion
- Lowest coefficient of any pure metal
- Key Physical Traits
- High Tensile StrengthLow Vapor PressureHigh DuctilityHigh Density
Technical Specifications
Chemical Purity
3N5 (99.95%)High Purity
Manufacturing Methods
- Forging
- Stretching
- Extrusion
- Sintering
Quality Analysis Methods
- GDMS (Metallic elements)
- ICP-OES (Metallic elements)
- LECO (Gas elements)
Applications
Primary Applications
- Semiconductor Manufacturing
- Micro-electronics
- TFT-LCD Screen Components
- Thin-film Transistors
Performance Metrics
Performance Advantages
1,650 °C
Low Vapor Pressure Threshold
99.95 %
Standard Purity
